CHANG CHUN PETROCHEMICAL CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1140
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM9148
 
  
 
H01M PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY 6148
 
  
 
B21C MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL516
 
  
 
C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 4112
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 4152
 
  
 
C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 3117
 
  
 
C07C ACYCLIC OR CARBOCYCLIC COMPOUNDS 2136
 
  
 
C07K PEPTIDES 2134
 
  
 
C08F MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 2123

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0037,887 GENE EXPRESSION REGULATION SYSTEM OF SYNECHOCOCCUS ELONGATUS PCC 7942 AND APPLICATION THEREOFMar 31, 17Feb 08, 18[C12N]
2017/0356,015 METHOD FOR PRETREATING WOOD DUST AND METHOD FOR MANUFACTURING BIOALCOHOLDec 08, 16Dec 14, 17[C12P]
2017/0157,554 APPARATUS FOR ABSORBING A COMPONENT FROM A GAS MIXTUREMay 09, 16Jun 08, 17[B01D]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9707738 Copper foil and methods of useJan 14, 16Jul 18, 17[C25D, H01C, B32B]
9709348 Heat-dissipating copper foil and graphene compositeOct 07, 16Jul 18, 17[C23C, C25D, F28F, B21C, H05K]
9711799 Copper foil having uniform thickness and methods for manufacturing the copper foilOct 03, 16Jul 18, 17[C25D, H01M]
9673646 Surface-treated electrolytic copper foil and method for wireless charging of flexible printed circuit boardAug 19, 16Jun 06, 17[H02J, C25D, B29C, B21C, C22F, B29K, C23F, B29L, H05K]
9647272 Surface-treated copper foilJan 14, 16May 09, 17[C25D, H01M]
9562298 Electrodeposited copper foilSep 15, 14Feb 07, 17[C25D, B21C]
9556093 Method for producing alkylphenolJan 20, 16Jan 31, 17[C07C]
9397343 Copper foil exhibiting anti-swelling propertiesOct 15, 15Jul 19, 16[H01M]
9388371 Electrolytic copper foil, cleaning fluid composition and method for cleaning copper foilOct 04, 13Jul 12, 16[C25D, B08B, B21C, C11D, B32B]
9365940 Method for producing porous copper foilJan 11, 11Jun 14, 16[C25D, F16M, C25C, H01M]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0114,367 METHOD FOR BACTERIAL GENOME EDITINGAbandonedMar 10, 16Apr 27, 17[C12N]
2016/0215,076 POLYVINYL ALCOHOL AND PURIFICATION METHOD THEREOFAbandonedJan 26, 16Jul 28, 16[C08F]
2015/0225,678 ELECTROLYTIC COPPER FOIL, CLEANING FLUID COMPOSITION AND METHOD FOR CLEANING COPPER FOILAbandonedApr 24, 15Aug 13, 15[C25D, B08B, C11D]
2013/0090,491 PHENOL-FREE PHOSPHITES DERIVATIVES AND PREPARATION THEREOFAbandonedDec 20, 11Apr 11, 13[C07F]
2007/0080,476 Method for producing ethylene-vinyl alcohol copolymer pelletsAbandonedMar 31, 04Apr 12, 07[B29B]
2005/0222,421 Process for preparing nicotinic acid and catalyst used in the methodAbandonedJun 25, 04Oct 06, 05[C07D]
2005/0215,733 Process for continuously producing ethylene-vinyl acetate copolymer and reaction systemAbandonedAug 19, 04Sep 29, 05[C08F]
2004/0082,705 One-pot water-resistant polyvinyl acetate copolymer aqueous emulsion and it preparationAbandonedJun 27, 03Apr 29, 04[C08J]
2004/0082,706 Water resistant polyvinyl acetate aqueous emulsion for applying to wood materialAbandonedJun 27, 03Apr 29, 04[C08J]
6572673 Process for preparing noble metal nanoparticlesExpiredJun 08, 01Jun 03, 03[B22F]
2002/0195,351 Copper electroplating composition for integrated circuit interconnectionAbandonedApr 12, 02Dec 26, 02[C23C, C09D]
2002/0197,404 Method of activating non-conductive substrate for use in electroless depositionAbandonedApr 11, 02Dec 26, 02[B05D]
6472023 Seed layer of copper interconnection via displacementExpiredJul 10, 01Oct 29, 02[C23C, B05D]

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